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Hi Reliability Screening Program

TEST DESCRIPTION

QUALITY ASSURANCE LEVELS

MIL STX STXV
INTERNAL VISUAL (PRE-CAP) INSPECTION  

 

TEMPERATURE CYCLING    (Method 1051 Condition G 10 cycles)
CONSTANT ACCELERATION 1/  (Method 2006 10k G's Y1 Axis only)  
PRE-BURN IN ELECTRICAL TEST
HIGH TEMPERATURE REVERSE BIAS (Burn-in)
Transistors = Method 1039  Cond. A
FETS = Method 1042  Cond. B
Diodes = Method 1038  Cond. A
SCR's = Method 1040  

 

FINAL ELECTRICAL PARAMETER (DC-100%)

HERMETIC SEAL (FINE & GROSS LEAK) /2 (Method 1071)
GROUP A    (Static Parameters @250C)  
GROUP B SOLDERABILITY /3  (Method 2026)  
GROUP B RESISTANCE TO SOLVENTS  (Method 1022)  
1/  Wire Bond Devices
2/  For Cavity Devices
3/  Without Aging

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